TS-TIF100 10020-11 Conductivity Thermal Pads Thermal Conductive Insulator For Radiators Heat Dissipation Structure
The TS-TIF®100 10020-11 Series thermally conductive interiace materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Excellent themal conductivity: 10.0 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
Applications:
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED Tv and lamps
| Typical Properties of TS-TIF®100 10020-11 Series |
| Property | Value | Test Method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.012~0.118inch (0.300~3.000mm) | ASTM D374 |
| Hardness (Shore OO) | 20 | ASTM D2240 |
| Density | 3.3g/cc | ASTM D297 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @ 1MHz | 6.5 | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹² Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 10.0W/m-K | ASTM D5470 |
Product Specifications
Standard Thickness:
0.012"(0.3 mm)~0.118" (3.0 mm) with increments of 0.01(0.25 mm).
Standard Size:
8"×16”(203 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1(Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes:FG(Fiberglass)provides enhanced strength, suitable for materials with thicknesses of0.01to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms. For other thicknesses or moreinformation, please contact us.
Packaging Details & Lead time
The packaging of Thermal Insulation Materials
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Independent R&D team
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TS-TIF100 10020-11 Conductivity Thermal Pads Thermal Conductive Insulator For Radiators Heat Dissipation Structure Images
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